Thin Titanium Wafer

Standard: GB/T
Material Designation: GR1 GR2
ODM&OEM: Available
  • Description

Thin titanium wafers are precision-engineered from high-quality titanium alloy material, offering a combination of lightweight properties, high strength, and excellent corrosion resistance. They maintain long-term stability even in harsh environments such as high humidity and elevated temperatures, making them an ideal choice for precision structural components in 3C consumer electronics and computer communication equipment.

 

Leveraging self-developed advanced processes, these titanium wafers enable high-precision stamping and surface treatment. They are widely used in applications such as smartphone mid-frames, communication device shielding covers, and internal structures of laptops, providing reliable support and protection for precision electronic components. This contributes to enhanced structural integrity and improved thermal management of the devices.

 

We possess a professional R&D team and a mature production system. We can supply thin titanium wafers in various standard specifications, and also support non-standard customization based on customer drawings or technical requirements to meet diverse needs across different application scenarios.

 

Details

Standard

GB/T3621一2007

Material Designation

GR1 GR2

Size

According to your requirements

Surface Finish

Polishing

OEM & ODM

Available

Packaging

Export standard wooden case, or can be customized

Application

3C Consumer Electronics, Computer and Communication, Chemical and Marine Engineering, Medical and Biotechnology etc

Contact Us

Deko Corporation

Address :  No.25,GaoXin 6th Road,

                 Hi-Tech Zone, Xi'an,                                         710065 China

Phone:      86-29-81870126, 81870128 
Email :       sales@globaltigroup.com

                  xakmtools@vip.163.com

Website:    www.globaltigroup.com

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